Multilayer boards, printed circuit boards and semiconductor packages

Abstract

A multilayer board, a printed circuit board using the multilayer board, and a semiconductor package, the multilayer board comprising: two or more glass cloths, and a cured material of a thermosetting resin composition, and satisfying condition 1: (Condition 1) In the aforementioned multilayer board, when the distance between the surfaces of two adjacent glass cloths in the same thickness direction is defined as the glass cloth distance D12 (μm), and the thickness of the glass cloth located on the side in the same thickness direction among the two adjacent glass cloths is defined as the thickness T1 (μm), the average value R of the ratio [D12×100 / T1] of the aforementioned glass cloth distance D12 (μm) to the aforementioned thickness T1 (μm) in the aforementioned multilayer board is 150 to 260%. none

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