Mold release film

Abstract

The present invention provides a mold release film that can effectively prevent formation of unintended recesses in a flexible printed circuit board when used in a heat pressing process for adhering a coverlay film to a flexible circuit board having an exposed circuit, or a mold release film having excellent mold release properties. A mold release film according to one embodiment of the present invention includes a mold release layer and a cushion layer, wherein the mold release layer is made from a material containing a polybutylene terephthalate-based resin, and the number of foreign particles having a maximum length of

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