Thermoforming laminates
TW202639352APending Publication Date: 2026-10-01MITSUBISHI GAS CHEM CO INC
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114143421
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-06-05
- Filing Date
- 2025-11-07
- Publication Date
- 2026-10-01
Smart Images

Figure TWG2TA001078447_001 
Figure TWG2TA001078447_002
Abstract
According to the present invention, a thermoforming laminate is provided, comprising a substrate layer and a hard coating layer; the substrate layer is formed by laminating a layer containing polycarbonate resin and a layer containing a high-hardness resin; the hard coating layer is laminated on the high-hardness resin layer in the substrate layer; the hard coating layer comprises (meth)acrylate aminocarboxylate resin (A), an organosilicon leveling agent (B) having photocurable polymeric groups, and a photopolymerization initiator (C); the organosilicon leveling agent (B) has a weight average molecular weight of 2000 or more to 15000 or less; the hard coating layer has a thickness of 1 μm to 10 μm.
Need to check novelty before this filing date? Find Prior Art
