Thermoforming laminates

TW202639352APending Publication Date: 2026-10-01MITSUBISHI GAS CHEM CO INC
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Patent Information

Application Number
TW114143421
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-06-05
Filing Date
2025-11-07
Publication Date
2026-10-01

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Abstract

According to the present invention, a thermoforming laminate is provided, comprising a substrate layer and a hard coating layer; the substrate layer is formed by laminating a layer containing polycarbonate resin and a layer containing a high-hardness resin; the hard coating layer is laminated on the high-hardness resin layer in the substrate layer; the hard coating layer comprises (meth)acrylate aminocarboxylate resin (A), an organosilicon leveling agent (B) having photocurable polymeric groups, and a photopolymerization initiator (C); the organosilicon leveling agent (B) has a weight average molecular weight of 2000 or more to 15000 or less; the hard coating layer has a thickness of 1 μm to 10 μm.
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