Radiosensitive linear components, patterning methods and compounds
TW202639487APending Publication Date: 2026-10-01JSR CORPORATION
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Patent Information
- Application Number
- TW115109584
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-17
- Filing Date
- 2026-03-16
- Publication Date
- 2026-10-01
Abstract
The object of the present invention is to provide a radiosensitive linear composition, a patterning method and a compound that can fully exert sensitivity, LWR and development defect suppression during patterning. A radiosensitive linear composition comprises a polymer (A) containing a structural unit (I) having an acid-dissociable group, a compound (B) represented by the following formula (1) and a solvent (S).
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