Resin composition, cured material, prepreg, copper-clad laminate, interlayer insulating film and compounds

Abstract

A resin composition, a cured material, a prepreg, a copper-clad laminate, an interlayer insulating film, and a compound, said resin composition comprising: compound (A), which is at least one of two or more compounds (A1) and (A2) represented by formula (1) below; and polymer (B), having a crosslinking group with said compound (A) and an aromatic ring. The description of each substituent in the formulas is provided in the specification.

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