Thermosetting resin composition, encapsulating material, and electronic component device
TW202639507APending Publication Date: 2026-10-01RESONAC CORP
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Patent Information
- Application Number
- TW115103486
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-30
- Filing Date
- 2026-01-29
- Publication Date
- 2026-10-01
Abstract
Provided are a thermosetting resin composition that exhibits excellent adhesion to adjacent members such as metals in a cured state, an encapsulating material, and an electronic component device. The thermosetting resin composition includes a thermosetting resin and a compound having a glycouril skeleton represented by the general formula
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