Compounds and their manufacturing methods, polyaryl sulfide resins and their manufacturing methods, and molded articles

TW202639514APending Publication Date: 2026-10-01DAICEL CORP
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Patent Information

Application Number
TW115100621
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-09
Filing Date
2026-01-07
Publication Date
2026-10-01
Patent Text Reader

Abstract

The first objective of this invention is to provide a compound and a method for manufacturing a poly(aryl sulfide) resin with low dielectric loss tangent that can be stably manufactured by easily controlling the reaction induction period during resin manufacturing. The second objective of this invention is to provide a poly(aryl sulfide) resin with good formability that can be used in wiring boards and other wiring substrate applications, and a method for manufacturing the same. The first embodiment of this invention is compound (I), represented by the following formula (1), wherein the iodine content is 1 ppb or more and less than 5500 ppb (in formula (1), R1 to R10 independently represent H, alkyl, alkoxy, alkenyl, or phenyl, and n represents an integer from 1 to 8). Furthermore, the second embodiment of this invention is a poly(aryl sulfide) resin (II), which contains the monomer unit of the above-mentioned compound (I), and the iodine content is 1 ppb or more and less than 5500 ppb. none
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