Photocurable resin composition, adhesive, sealant, coating agent, cured product semiconductor device, electronic component, and curing, adhesion, sealing and coating methods using a photocurable resin composition

Abstract

The present invention aims to provide a photocurable resin composition, an adhesive, a sealant or coating agent containing the photocurable resin composition, a cured product thereof, a semiconductor device or electronic component containing the cured product, and a curing method, an adhesion method, a sealing method and a coating method using the photocurable resin composition, with regard to photocurable resin composition for curing that uses a photon upconversion mechanism, and a method for using the same, the photocurable resin composition being able to achieve a good degree of curing by extending duration of photon upconversion light emission. Provided as a solution in the present invention are a photocurable resin composition; an adhesive, a sealant or coating agent containing the photocurable resin composition; a cured product thereof; a semiconductor device or electronic component containing the cured product; and a cured method, an adhesion method, a sealing method, and a coating method using the photocurable resin composition. The photocurable resin composition contains (A) a polymerizable compound, and (B) triplet-triplet annihilation photon upconversion particles, and the photocurable resin composition satisfies at least one of the following characteristics (a) and (b): (a) the (A) polymerizable compound contains a maleimide compound, (b) the photocurable resin composition contains (C) a photopolymerization initiator.

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