Negative photosensitive resin composition, method for manufacturing hardened embossed patterns, and semiconductor device

Abstract

This invention provides a negative photosensitive resin composition with high room temperature storage stability, and a cured film obtained by curing the above photosensitive resin composition, which has a high glass transition temperature and maintains a high elongation after reliability testing. Furthermore, this invention provides a method for manufacturing a cured embossed pattern using the above negative photosensitive resin composition. This invention provides a negative photosensitive resin composition comprising (A) a polyimide precursor containing structural units represented by the following general formula (1), (B) a photopolymerization initiator, and (C) a bismaleimide compound. In the above general formula (1), X is an organic group represented by the following formula (2), and / or Y is an organic group represented by the following general formula (3).