Curable components, prepregs, metal-clad laminates, printed circuit boards, and semiconductor packages
TW202639627APending Publication Date: 2026-10-01RESONAC CORP
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Patent Information
- Application Number
- TW114148310
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-12
- Filing Date
- 2025-12-10
- Publication Date
- 2026-10-01
Abstract
A curable composition comprising: a compound (A) comprising an indene ring and a vinylbenzyl group; and a hollow filler (B). none
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