Curable resin composition and its cured products

TW202639636APending Publication Date: 2026-10-01NIPPON KAYAKU CO LTD
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Patent Information

Application Number
TW115106240
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-18
Filing Date
2026-02-13
Publication Date
2026-10-01

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Abstract

This invention provides a curable resin composition and its cured product exhibiting excellent heat resistance and low dielectric properties. A curable resin composition comprises: a maleimide resin having a maleimide equivalent of 250 g / eq. to 1000 g / eq. and having one or more structures represented by the following formula (1) within the molecule; and a copolymer comprising ethylene, styrene, and divinylbenzene. (In formula (1), Ar is a substituted or unsubstituted aryl group.)
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