Photosensitive or radiosensitive linear resin compositions, photoresist films, patterning methods, and manufacturing methods of electronic devices.

Abstract

The present invention provides a photosensitive radioactive or radioactive linear resin composition, a photoresist film formed using the above-mentioned photosensitive radioactive or radioactive linear resin composition, a pattern forming method using the above-mentioned photosensitive radioactive or radioactive linear resin composition, and a method for manufacturing an electronic device. The photosensitive radioactive or radioactive linear resin composition contains a resin (A) whose polarity is increased by the action of an acid and a Si-based surfactant. The surface tension of the above-mentioned photosensitive radioactive or radioactive linear resin composition is 25 mN / cm or more.