Polymerizable polymer, polymeric composition comprising the polymerizable polymer, and laminate using the polymeric composition

TW202639639APending Publication Date: 2026-10-01NITTO DENKO CORP +1
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Patent Information

Application Number
TW115107612
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-10
Filing Date
2026-03-03
Publication Date
2026-10-01

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Abstract

This invention provides a polymeric polymer capable of producing an adhesive with excellent adhesion. The polymeric polymer of this embodiment is a copolymer of phenylboronic acid (meth)acrylamide and (meth)acrylic acid monomers, and has a polymeric group at at least one end. The polymeric composition of this embodiment comprises the above-mentioned polymeric polymer and monomers that can copolymerize with the polymeric polymer. The laminate of this embodiment has a first resin layer and a second resin layer bonded to the first resin layer through an adhesive layer; the adhesive layer is a hardened layer of the above-mentioned polymeric composition and has a microphase separation structure.
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