Epoxy resin compositions, sealing materials, conductive materials, thermally conductive materials, insulating materials, adhesives for camera modules, structural adhesives, matrix resins for fiber-reinforced plastics, impregnated binders, interlayer insulating films, thin-film solder resists, sealing sheets, conductive films, anisotropic conductive films, and thermally conductive films.

Abstract

This invention provides an epoxy resin composition that balances the suppression of bubble formation and adhesion. The epoxy resin composition of this invention comprises an epoxy resin (A) and a hardener (B), and in the infrared absorption spectrum of the epoxy resin composition measured by infrared spectroscopy, the ratio (P2 / P1) of the maximum peak intensity (P1) in the range of 880–950 cm⁻¹ to the maximum peak intensity (P2) in the range of 2200–2350 cm⁻¹ is 0.005 or more and 0.2 or less.