conductive paste
TW202639664APending Publication Date: 2026-10-01TATSUTA ELECTRICWIRE & CABLE
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Patent Information
- Application Number
- TW115100521
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-21
- Filing Date
- 2026-01-07
- Publication Date
- 2026-10-01
Smart Images
Figure 00000019_0000
Abstract
The objective of this invention is to provide a conductive paste that exhibits good flowability and forms a hardened material with excellent conductivity. A conductive paste for forming a hardened material filling holes in a circuit board comprises an epoxy resin, a hardener, and conductive particles, at least the surface of which is formed of metal, and the conductive particles are spherical with a particle size distribution D50 of 1 μm or more and 7 μm or less.
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