Compositions, curable compositions, cured materials, sealing materials containing compositions, conductive materials, thermally conductive materials, insulating materials, adhesives for camera modules, adhesives for structures, matrix resins for fiber-reinforced plastics, impregnated curing agents, interlayer insulating films, thin-film solder resists, sealing sheets, conductive films, anisotropic conductive films, and thermally conductive films.

Abstract

This invention relates to a composition comprising: component A: a compound represented by formula (1) below; and component B: a compound represented by formula (2) below; (in formulas (1) and (2) above, R1 is selected from the group consisting of ethyl, n-propyl, isopropyl, and n-butyl, and when multiple R1s are contained, they may be the same or different; R2 represents a divalent group having a six-membered ring structure; R3 is selected from the group consisting of ethyl, n-propyl, isopropyl, and n-butyl, and when multiple R3s are contained, they may be the same or different; Gy represents glycidyl; G1 and G2 represent glycidyl or hydrogen; L and M are each independently an integer from 1 to 15; L and M satisfy 2 ≤ (L + M) ≤ 16; N is an integer from 1 to 10).