Mixtures, hardeners, curing compositions, methods for manufacturing hardened bodies, prepregs, and semiconductor sealants
TW202639675APending Publication Date: 2026-10-01ASAHI KASEI KOGYO KABUSHIKI KAISHA
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Patent Information
- Application Number
- TW115103357
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-28
- Filing Date
- 2026-01-28
- Publication Date
- 2026-10-01
Abstract
The object of this invention is to provide a mixture comprising an amino-containing polyphenylene ether, which yields a cured product with high heat resistance and low moisture absorption. The mixture of this invention is characterized in that it comprises a compound having an active hydrogen group and a compound reacting with the aforementioned compound having an active hydrogen group, wherein the aforementioned compound having an active hydrogen group contains an amino-containing polyphenylene ether (A), which comprises the constituent components represented by general formula (a).
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