Mixtures, hardeners, curing compositions, methods for manufacturing hardened bodies, prepregs, and semiconductor sealants

TW202639675APending Publication Date: 2026-10-01ASAHI KASEI KOGYO KABUSHIKI KAISHA
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Patent Information

Application Number
TW115103357
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-28
Filing Date
2026-01-28
Publication Date
2026-10-01
Patent Text Reader

Abstract

The object of this invention is to provide a mixture comprising an amino-containing polyphenylene ether, which yields a cured product with high heat resistance and low moisture absorption. The mixture of this invention is characterized in that it comprises a compound having an active hydrogen group and a compound reacting with the aforementioned compound having an active hydrogen group, wherein the aforementioned compound having an active hydrogen group contains an amino-containing polyphenylene ether (A), which comprises the constituent components represented by general formula (a).
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