Polyamide resin composition, molded body, and sliding component
TW202639687APending Publication Date: 2026-10-01KURARAY CO LTD
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Patent Information
- Application Number
- TW115104773
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-07
- Filing Date
- 2026-02-06
- Publication Date
- 2026-10-01
Abstract
A polyamide resin composition comprising a semi-aromatic polyamide resin (A), a modified polyolefin resin (B), and a fibrous filler (C), wherein the semi-aromatic polyamide resin (A) comprises dicarboxylic acid units and diamine units, wherein 60-100 mol% of the dicarboxylic acid units are aromatic dicarboxylic acid units, and 60-100 mol% of the diamine units are aliphatic diamine units with 4-18 carbon atoms, wherein the polyamide resin composition has a terminal amine group content [NH2] of 20-100 μequivalents / g, and a melt flow rate (MFR) of 2.0-15 g / 10 min at a temperature of 320°C and a load of 2.16 kg as determined by JIS K7210:1999.
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