Resin composition, photosensitive resin composition, cured product, laminate, production method for cured product, production method for semiconductor device, and semiconductor device

Abstract

The present invention aims to provide a resin composition and a photosensitive resin composition with excellent long-term stability, as well as a method for manufacturing a cured material, a laminate, a method for manufacturing a cured material, and a semiconductor device. The resin composition of the present invention comprises at least one resin selected from the group consisting of polyimides having vinyl unsaturated groups and polyimide precursors having vinyl unsaturated groups, and a polymerization inhibitor having vinyl unsaturated groups.