Solvent-soluble polyimide resin and polyimide film

Abstract

A polyimide resin comprising structural unit A derived from a tetracarboxylic dianhydride and structural unit B derived from a diamine, wherein structural unit A includes structural unit A1 derived from a compound represented by the following formula (a1), and structural unit B includes structural unit B1 derived from a compound represented by the following formula (b1), and wherein, the polyimide resin is a solvent-soluble polyimide resin. The present invention provides a solvent-soluble polyimide resin having excellent colorless transparency, heat resistance, and solubility in organic solvents, a polyimide varnish containing the polyimide resin, and a polyimide film containing the polyimide resin.