Silicon-containing composition and patterning process

TW202639697APending Publication Date: 2026-10-01SHIN ETSU CHEMICAL CO LTD
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Patent Information

Application Number
TW115101935
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-20
Filing Date
2026-01-19
Publication Date
2026-10-01

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Abstract

and (C) a solvent. This can provide: a silicon-containing composition excellent in properties of forming a film in and filling a pattern of a stepped substrate; and a patterning process using the silicon-containing composition. The present invention can also provide a silicon-containing composition that can minimize the effect on the human body and the environment by the use of a surfactant to which the PFAS regulations of the European REACH do not apply.
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