Polyimide films, laminates, semiconductor devices and flexible devices
TW202639703APending Publication Date: 2026-10-01NIPPON STEEL CHEM & MATERIAL CO LTD
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Patent Information
- Application Number
- TW114148863
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-09-29
- Filing Date
- 2025-12-12
- Publication Date
- 2026-10-01
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Figure TWG2TA001078790_001 
Figure TWG2TA001078790_002
Abstract
A polyimide film containing more than 50% by weight of polyimide as the main component of all resin components, wherein the polyimide film meets the following conditions in a tensile test: a) the elongation at break at 25°C is more than 100%; b) the stress at 100% elongation at a tensile speed of 10 mm / min is less than 10.0 MPa; c) after 100% elongation at a tensile speed of 10 mm / min, the recovery rate after releasing the tensile load and after 24 hours is more than 85%.
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