Hardened materials and printed circuit boards, and methods for manufacturing them.

Abstract

This invention provides a cured material that balances the wetting and diffusion of the underfill adhesive with its adhesion to EMC. The cured material of this invention is obtained using a curable resin composition comprising a curable resin and an inorganic filler, characterized in that: the content of the inorganic filler, converted from solids, is 30% or more relative to the total amount of the curable resin composition; and the exposed proportion of the inorganic filler on the surface of the cured material is 20% or more and 85% or less.