Resin composition, cured material, laminate, method for manufacturing cured material, method for manufacturing laminate, method for manufacturing semiconductor device, and semiconductor device.

Abstract

A resin composition, a cured material, a laminate, a method for manufacturing the cured material, a method for manufacturing the laminate, a method for manufacturing a semiconductor device, and a semiconductor device, wherein the resin composition contains a polyimide precursor, an acidic compound, and a basic compound, wherein the first dissociation constant of the conjugate acid of the basic compound is 12.0 or more, the first dissociation constant of the acidic compound is 5.0 or less, and the ratio X / Y of the amount of acidic compound added X [mol] to the amount of basic compound added Y [mol] is 1.01 or more.