Positive photosensitive resin composition, method for forming insulating resin film, insulating resin film and semiconductor device

Abstract

A positive photosensitive resin composition comprises: an alkali-soluble resin having phenolic hydroxyl groups; a photoacid generator, a compound that generates acid by light; and a thermal crosslinking agent, a compound that crosslinks the alkali-soluble resin by heat. The thermal crosslinking agent contains an epoxy compound having a plurality of epoxy groups and a straight-chain aliphatic group directly bonded to the epoxy groups and potentially containing heteroatoms. The straight-chain aliphatic group comprises three or more atoms connected in series to form a straight chain.

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