Positive photosensitive resin composition, method for forming insulating resin film, insulating resin film and semiconductor device

Abstract

A positive photosensitive resin composition comprises: an alkali-soluble resin having phenolic hydroxyl groups; a photoacid generator, a compound that generates acid by light; and a thermal crosslinking agent, a compound having a plurality of reactive functional groups that react with the aforementioned alkali-soluble resin by heat. The thermal crosslinking agent comprises: a first component having four or more reactive functional groups; and a second component having two or more but three or fewer reactive functional groups.

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