Resin substrate, metal foil laminate, and wiring board

TW202639722APending Publication Date: 2026-10-01ASAHI KASEI KOGYO KABUSHIKI KAISHA
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Patent Information

Application Number
TW115101758
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-07
Filing Date
2026-01-16
Publication Date
2026-10-01
Patent Text Reader

Abstract

This invention relates to a resin substrate comprising a glass cloth woven from glass yarn with a Si content (converted to SiO2) ranging from 95% to 100% by mass, and a resin composition. The glass cloth, calculated by the formula: yarn width variation coefficient = yarn width standard deviation [μm] / yarn width [μm], has a value of less than 0.20 in both the warp and weft directions, and a loss tangent (tanδ) of less than 0.34 at 200°C.
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