(Meth)acrylic resins, solvent compositions, slurry compositions, and electronic components.

TW202639730APending Publication Date: 2026-10-01SEKISUI CHEMICAL CO LTD
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Patent Information

Application Number
TW115102529
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-24
Filing Date
2026-01-22
Publication Date
2026-10-01
Patent Text Reader

Abstract

This invention provides a (meth)acrylic resin capable of producing conductive paste with less viscosity unevenness. Furthermore, this invention provides a liquid composition comprising the (meth)acrylic resin, a slurry composition comprising the liquid composition, and an electronic component manufactured using the slurry composition. This invention relates to a (meth)acrylic resin having at least one constituent unit derived from monomer A and a constituent unit derived from monomer B. Monomer A is a methacrylate monomer having repeating units of propylene oxide, and has a weight-average molecular weight (Mw) of 600-900 converted from polystyrene, with a molecular weight dispersion of 1.03-1.09. Monomer B is a methacrylate monomer having repeating units of ethylene oxide, and has a weight-average molecular weight (Mw) of 1400-2100 converted from polystyrene, with a molecular weight dispersion of 1.02-1.07. When the content of the constituent unit derived from the total monomer component is set to 100% by weight, the total content of the constituent units derived from monomer A and monomer B is 1-30% by weight. none
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