Resin composition for forming phase-separated structure and method for producing structure including phase-separated structure

TW202639733APending Publication Date: 2026-10-01TOKYO OHKA KOGYO CO LTD
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Patent Information

Application Number
TW114147525
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-11
Filing Date
2025-12-04
Publication Date
2026-10-01

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Abstract

Problem: To provide a resin composition for forming a phase separation structure, and a method for manufacturing a structure containing a phase separation structure using the resin composition. This resin composition provides a coating with uniform film thickness, and even when forming a thick film with a phase separation structure, it can suppress the generation of defects in the film while providing a film with good phase separation. Solution: A resin composition for forming a phase separation structure contains a block copolymer (A) and an organic solvent (S), wherein the organic solvent (S) comprises: propylene glycol monomethyl ether acetate (S1); and a solvent (S2) having a boiling point of 225°C or higher and 275°C or lower at atmospheric pressure and having an ester group.
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