Curable resin compositions, adhesive films, laminates, cured materials, and semiconductor devices.

Abstract

This invention provides a curable resin composition exhibiting excellent transferability when forming an adhesive film. Furthermore, it provides an adhesive film and a laminate exhibiting excellent transferability, a cured adhesive film, and a semiconductor device including the cured film. A curable resin composition comprises a thermosetting resin (A) and an inorganic filler (C), further comprising a silane coupling agent (D), or comprising an inorganic filler (C2) modified with the silane coupling agent (D) as the inorganic filler (C), and wherein the curable resin composition satisfies the following formula (1): G / R ≥ 160 (1) (wherein, G represents the gloss (%) of the curable resin composition at an incident angle of 60° in the B-stage state; R represents the maximum height roughness Rz (μm) of the curable resin composition in the B-stage state).