Lead-free solder flux

TW202639743APending Publication Date: 2026-10-01ARAKAWA CHEM IND LTD
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Patent Information

Application Number
TW115111837
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-27
Filing Date
2026-03-26
Publication Date
2026-10-01

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Abstract

The present invention provides a lead-free solder flux, which is excellent in wettability and forms bumps with few depressions during installation, and the flux residue is effectively removed during subsequent cleaning. A lead-free solder flux containing a rosin-based resin (A), an activator (B), an alkylene glycol monoalkyl ether having a branched alkoxy group (C), and a thixotropic agent (D), wherein component (B) contains a hydrogenated dimer acid (B1).
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