Thermally conductive silicone composition
TW202639747APending Publication Date: 2026-10-01DOW SILICONES CORP
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Patent Information
- Application Number
- TW114147229
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-18
- Filing Date
- 2025-12-03
- Publication Date
- 2026-10-01
Abstract
The present invention is a composition comprising a) filler particles as defined herein; b) a first polyorganosiloxane functionalized with at least two Si-H groups; c) a second polyorganosiloxane functionalized with at least two ethylenically unsaturated groups; d) one or more treating agents of Formula
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