Methods of depositing thermally conductive polymeric films
TW202639769APending Publication Date: 2026-10-01APPLIED MATERIALS INC
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Patent Information
- Application Number
- TW114138991
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-07
- Filing Date
- 2025-10-09
- Publication Date
- 2026-10-01
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Figure TWG2TA001078342_001 
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Abstract
Methods of depositing thermally conductive polymeric films are described. Each of the methods include flowing a first precursor over a substrate; removing a first precursor effluent comprising the first precursor; flowing a second precursor over the substrate to react with the first precursor to form the polymeric film on the substrate; and removing a second precursor effluent comprising the second precursor. The methods may include performing a metal deposition process. The methods may include performing a post-treatment process, such as a heat treatment process.
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