Manufacturing methods for components, modified substrates, multilayers, and electronic devices

Abstract

This invention provides a composition capable of forming a coating that sufficiently suppresses films formed by atomic layer deposition (ALD), as well as a method for manufacturing a modified substrate, a method for manufacturing a laminate, and a method for manufacturing an electronic device. The composition of this invention, used to form a coating on a substrate that suppresses films formed by ALD, comprises: a compound having functional groups that interact with the substrate; water; and a specific component selected from the group consisting of an organic solvent, a nonionic surfactant, and a pH adjuster. The compound has a ClogP of 5.0 or more; the water content is 60.000% by mass or more relative to the total mass of the composition; the organic solvent has a ClogP of -1.0 to 1.5 and a Hansen solubility parameter distance of 13.0 MPa1 / 2 or less; the nonionic surfactant has a hydrophilic-lipophilic balance value of 12.0 to 18.0; and the pH adjuster has a minimum acid dissociation constant of 4.5 or less or a maximum acid dissociation constant of 9.0 or more.