CMP slurry composition for polishing copper layer and method for polishing copper layer using the same

Abstract

Disclosed herein are a CMP slurry composition for polishing a copper layer, and a method of polishing a copper layer using the CMP slurry composition. The CMP slurry composition includes at least one solvent from a polar solvent and a nonpolar solvent, an abrasive agent, and a corrosion inhibitor. The corrosion inhibitor includes a mixture of a first corrosion inhibitor and a second corrosion inhibitor. The first corrosion inhibitor includes a triazole based compound. The second corrosion inhibitor includes a pyrazine based or triazine based compound, substituted with at least one substituted or unsubstituted amino group or at least one substituted or unsubstituted aminoalkyl group.