Method for manufacturing electronic device

Abstract

A method for manufacturing an electronic device includes: step (a) preparing a structure (100) comprising an adhesive film (50) having a substrate layer (10) and a cationic curable resin layer (A), and an electronic component (70) attached to the cationic curable resin layer (A) of the adhesive film (50) in a manner directly in contact with the cationic curable resin layer (A); step (b) subjecting the structure (100) to one or more treatments selected from the group consisting of light irradiation and heat treatment; and step (c) after step (b) sealing the electronic component (70) with a sealing material (60), wherein the cationic curable resin layer (A) comprises a cationic curable compound and an acid generating agent. A method for manufacturing an electronic device includes: a step (a) of preparing a structure (100) including an adhesive film (50) having a substrate layer (10) and a cationic curable resin layer (A), and an electronic component (70) attached so as to be in direct contact with the cationic curable resin layer (A) of the adhesive film (50); a step (b) of subjecting the structure (100) to one or more treatments selected from the group consisting of light irradiation and heat treatment; and a step (c) of sealing the electronic component (70) with a sealant (60) after the step (b), wherein the cationic curable resin layer (A) contains a cationic curable compound and an acid generator.

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