Adhesive sheet

TW202639781APending Publication Date: 2026-10-01NITTO DENKO CORP
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Patent Information

Application Number
TW114125973
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-28
Filing Date
2025-07-09
Publication Date
2026-10-01

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Abstract

This invention provides an adhesive sheet for use in electronic component transfer processes, which exhibits better peelability when irradiated with laser light of a specific wavelength. The adhesive sheet of this invention, used in electronic component transfer processes, comprises a transmissive layer and an absorbent layer disposed on one side of the transmissive layer. The transmissive layer has a transmittance of 50% or more for light at a wavelength of 248 nm, the absorbent layer has a transmittance of 5% or less for light at a wavelength of 248 nm, and the transmissive layer has a tensile modulus of elasticity of 0.1 MPa or more at 23°C.
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