Composition for forming adhesive layer, laminate, and method for manufacturing semiconductor package
TW202639790APending Publication Date: 2026-10-01NIPPON STEEL CHEM & MATERIAL CO LTD
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Patent Information
- Application Number
- TW115108803
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-17
- Filing Date
- 2026-03-10
- Publication Date
- 2026-10-01
Abstract
This invention provides an adhesive layer forming composition that improves adhesion to a metal layer. The adhesive layer forming composition comprises (A) a polymeric resin containing unsaturated groups, (B) a coupling agent, and (D) a solvent. The weight average molecular weight of component (B) is 500 to 5000. The content of component (B) relative to the total mass of component (A) is 0.2% to 8.0% by mass.
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