Grinding composition

Abstract

Issue: The issue concerns providing a novel polishing composition that guarantees a certain or higher polishing speed for films containing silicon-silicon bonds, such as polysilicon. By increasing the ratio of the polishing speed of the polysilicon film containing silicon-silicon bonds to the polishing speed of insulating films such as films containing oxygen-silicon bonds, it can function as a stop layer and also suppress the aforementioned micro-scratches. Solution: A polishing composition comprising colloidal silica with a silyl group number of greater than 2 and less than 6 per nm², a nitrogen-containing basic compound, and a liquid carrier, wherein, when the concentration of the aforementioned colloidal silica is 1.5% by mass, the transmittance when light with a wavelength of 450 nm passes through is greater than 1.10% and less than 100%, and the pH is 9.0 to 11.5.

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