Methods for processing pharmaceutical solutions and substrates, and methods for manufacturing electronic components.

Abstract

This invention provides a solution for treating a substrate subjected to chemical mechanical polishing (CMP) with low residual anionic components and low residue, a method for treating a substrate using the aforementioned solution, and a method for manufacturing electronic components. The solution of this invention is for use on substrates subjected to CMP, and contains: an anionic polymer; one or more specific anions selected from the group consisting of SO42-, NO3-, PO43-, F-, Cl-, and Br-; and water, wherein the total content of the aforementioned specific anions is 1.0 to 1000 ppb by mass relative to the total mass of the solution.