Copper alloys and electronic components

TW202639876APending Publication Date: 2026-10-01JX NIPPON MINING & METALS CORP
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Patent Information

Application Number
TW115103992
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-05
Filing Date
2026-02-02
Publication Date
2026-10-01

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Abstract

The copper alloy disclosed herein contains 1.5% to 5.0% by mass of Ti, with the remainder consisting of Cu and unavoidable impurities. The ratio of the integrated intensity I(220) of the peak of the (220) plane obtained by X-ray diffraction measurement of the surface of the copper alloy to the integrated intensity I0(220) of the peak of the (220) plane obtained by X-ray diffraction measurement of pure copper standard powder (I(220) / I0(220)) is 2.00 or more but less than 5.64. none
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