Copper bonding wire, and semiconductor device, metal-oxide-semiconductor field-effect transistor, inverter, insulated-gate bipolar transistor, lithium-ion battery module and electric vehicle using the same

TW202639877APending Publication Date: 2026-10-01TANAKA DENSHI KOGYO KK
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Patent Information

Application Number
TW115106027
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-09-16
Filing Date
2023-09-14
Publication Date
2026-10-01

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    Figure TWG2TA001079363_003
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Abstract

A copper bonding wire is provided that improves cutting performance, bonding strength, and followability, and suppresses wire peeling and tool detachment. The copper bonding wire is a copper wire composed of a copper alloy with a copper purity of
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