Mid temperature alloys for solder hierarchy

TW202639878APending Publication Date: 2026-10-01ALPHA ASSEMBLY SOLUTIONS INC
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Patent Information

Application Number
TW114147662
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-06
Filing Date
2025-12-05
Publication Date
2026-10-01

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Abstract

wt.% gallium, and the balance tin, together with any unavoidable impurities.
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