Area-selective deposition using carbon as an inhibitor

TW202639911APending Publication Date: 2026-10-01LAM RES CORP
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Patent Information

Application Number
TW115101950
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-10-13
Filing Date
2026-01-19
Publication Date
2026-10-01

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Patent Text Reader

Abstract

Examples are disclosed that relate to performing area-selective deposition of a film using carbon as a geometrically-selective inhibitor. One example provides a method of depositing a film. The method comprises exposing a substrate to a carbon-containing precursor under conditions configured to result in geometrically-selective carbon deposition on the substrate, thereby forming a carbon film on selected regions of the substrate. The method further comprises exposing the substrate to one or more film precursors to deposit a film of a target material on the substrate not covered by the carbon film. The method further comprises removing the carbon film.
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