Substrate processing apparatus and substrate processing method
TW202639930APending Publication Date: 2026-10-01SHIBAURA MECHATRONICS CORP
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Patent Information
- Application Number
- TW115106549
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-21
- Filing Date
- 2026-02-24
- Publication Date
- 2026-10-01
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Figure TWG2TA001079385_001 
Figure TWG2TA001079385_002 
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Abstract
A substrate processing apparatus and a substrate processing method are provided to suppress substrate contamination. The substrate processing apparatus (1) includes: a processing liquid supply unit (20); a heating unit (60) for heating the substrate (Wp) and substrate (Wd) by irradiating them with light; a cover (63) having a facing surface (631) facing the substrate (Wp) and substrate (Wd) held by the rotating holding unit (10) so that light irradiated by the heating unit (60) can pass through; and a control device (80) for controlling the supply of processing liquid (Lp) to the rotating substrate (Wp) to process the substrate (Wp) and perform a first drying process, wherein the substrate (Wd) is heated by irradiating it with light held by the rotating holding unit (10) so that the facing surface (631) of the cover (63) is dried.
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