Substrate processing apparatus and substrate processing method

TW202639930APending Publication Date: 2026-10-01SHIBAURA MECHATRONICS CORP
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Patent Information

Application Number
TW115106549
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-21
Filing Date
2026-02-24
Publication Date
2026-10-01

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    Figure TWG2TA001079385_002
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    Figure TWG2TA001079385_003
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Abstract

A substrate processing apparatus and a substrate processing method are provided to suppress substrate contamination. The substrate processing apparatus (1) includes: a processing liquid supply unit (20); a heating unit (60) for heating the substrate (Wp) and substrate (Wd) by irradiating them with light; a cover (63) having a facing surface (631) facing the substrate (Wp) and substrate (Wd) held by the rotating holding unit (10) so that light irradiated by the heating unit (60) can pass through; and a control device (80) for controlling the supply of processing liquid (Lp) to the rotating substrate (Wp) to process the substrate (Wp) and perform a first drying process, wherein the substrate (Wd) is heated by irradiating it with light held by the rotating holding unit (10) so that the facing surface (631) of the cover (63) is dried.
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