Electroplating solution and preparation method thereof and forming metal coating film

Abstract

An electroplating solution suitable for electroplating processes, comprising: a precipitate solution, tantalum tetrachloride, an inorganic acid, ammonium fluoride, sodium citrate, scandium chloride, and EM bacterial solution, wherein the precipitate solution is a mixture of choline chloride and urea in a 1:2 molar ratio, the molar concentration of tantalum tetrachloride is 0.02M, the molar concentration of the inorganic acid is 0.01M, the molar concentration of the ammonium fluoride is 0.01M, the molar concentration of the sodium citrate is 0.025M, and the molar concentration of the EM bacterial solution is 0.05M. An electroplating solution is applied for an electroplating process. The electroplating solution includes a deep eutectic solution, tantalum tetrachloride, inorganic acid ammonium fluoride, sodium citrate, scandium chloride and EM bacterial solution. and the molar concentration of inorganic acid is 0.01M. The molar concentration of ammonium fluoride is 0.01M. The molar concentration of sodium citrate is 0.025M. The molar concentration of scandium chloride is 0.0067M. The molar concentration of EM bacterial solution is 0.05M.

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