Surface-treated copper foil and copper-clad laminate
TW202639963APending Publication Date: 2026-10-01JX NIPPON MINING & METALS CORP
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Patent Information
- Application Number
- TW115105445
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-27
- Filing Date
- 2026-02-11
- Publication Date
- 2026-10-01
Abstract
This invention provides a surface-treated copper foil that improves adhesion to a resin layer. [Solution] A surface-treated copper foil comprises a copper foil and a surface-treated layer disposed on at least one surface of the copper foil. The surface-treated layer comprises at least one selected from Ni and Co, and at least one selected from W and Mo. none
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