Coating device

TW202639967APending Publication Date: 2026-10-01EBARA CORP
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Patent Information

Application Number
TW114111944
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-28
Publication Date
2026-10-01

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    Figure TWG2TA001077957_001
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    Figure TWG2TA001077957_003
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Abstract

This invention provides a technique to suppress the scattering of plating solution outside the plating tank when the plating solution is stirred. The anti-scattering component of the plating apparatus of this invention has: a first component 61 and a second component 62. The first component is disposed above the impeller and below the upper end of the outer peripheral wall of the plating tank, and is disposed in the region between the outer peripheral wall of the plating tank and the substrate holder, extending in the vertical direction and extending in a curved shape in the circumferential direction of the outer peripheral wall of the plating tank; the second component extends in the horizontal direction and is disposed above the upper end of the outer peripheral wall of the plating tank, having a first space between itself and the first component, and is disposed above the first component, having a second space between itself and the substrate holder, and is disposed outside the substrate holder. An inclined surface is formed on the inner peripheral surface of the first component at least a distance below the upper end of the first component, such that the distance from the center of the plating tank increases as it faces upward.
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