Contact compartment for substrate holder of electroplating apparatus

TW202639968APending Publication Date: 2026-10-01LAM RES CORP
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Patent Information

Application Number
TW115104949
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-12
Filing Date
2026-02-09
Publication Date
2026-10-01

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Abstract

An electroplating apparatus may include (a) electrical contacts for contacting a peripheral region of a substrate during the electroplating; (b) a lip seal configured to (i) contact the substrate and prevent electrolyte from contacting the electrical contacts while they contact the peripheral region of the substrate, and (ii) form a lip seal cavity including at least a portion of the lip seal and a portion of the substrate; and (c) an inlet and an outlet configured to flow the liquid through the lip seal cavity prior to, during, and / or after the electroplating.
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