Wafer rotary drying mechanism

Abstract

This invention discloses a wafer rotary drying mechanism, comprising: a rotary platform; multiple grippers connected to the rotary platform and circumferentially spaced; each gripper having a supporting surface and a clamping surface facing the wafer, or the grippers and the rotary platform cooperate to form a supporting surface and a clamping surface, which are used to jointly clamp the wafer; and a centrifugal drainage channel between the supporting surface and the clamping surface. When the supporting surface and the clamping surface clamp the wafer, at least a portion of the centrifugal drainage channel is located below the height of the lower surface of the wafer. During wafer rotation, liquid retained on the back side of the wafer enters the centrifugal drainage channel under centrifugal force and is discharged outward by centrifugal force. This invention designs a centrifugal drainage channel that can provide guidance and discharge space for liquid flowing radially across and near the supporting surface during centrifugal rotary drying, allowing residual liquid to be discharged smoothly.

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